Chip Quik SMDLTLFP50T3 Solder Paste in jar 50g (T3) Sn42/Bi57.6/Ag0.4 Low Temperature
Produktdetails
| Artikelnummer | 218684210 | Erscheinungsdatum | 2026/05/03 | Listenpreis | €14.49 | Modellnummer | 218684210 | ||
|---|---|---|---|---|---|---|---|---|---|
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Lead-Free / RoHS 3 Compliant / REACH Compliant Description Solder Paste in jar 50g (T3) Sn42/Bi57.6/Ag0.4 Low Temperature 90% metal melts @ 138C, 281F. Alloy: Sn42/Bi57.6/Ag0.4 Flux Type: Synthetic No-Clean Flux Classification: REL0 Metal Content: 90% metal by weight. Particle Size: T3 (25-45 microns) Melting Point: 138C (281F) Size: 50g jar Shelf Life Refrigerated >6 months, unrefrigerated >2 months Stencil Life >8 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
- Solder Paste
| Material | metal |
|---|---|
| Item Weight | 1.19 pounds |
| Part Number | SMDLTLFP50T3 |
| Manufacturer | Chip Quik® |
| Item model number | SMDLTLFP50T3 |
| Batteries Included | No |
| Batteries Required | No |
| Package Dimensions | 14.49 x 3.5 x 2.56 inches |
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